SEI Laser PAPER BLASTER 02SEI Laser
PAPER BLASTER 02
SEI Laser PAPER BLASTER 02
SEI Laser
PAPER BLASTER 02
Tahun pembuatan
2008
Keadaan
Terpakai
Lokasi
Poland 

Data asas
- Nama mesin:
- SEI Laser PAPER BLASTER 02
- Pengeluar:
- SEI Laser
- Model:
- PAPER BLASTER 02
- Tahun pembuatan:
- 2008
- Keadaan:
- sedia untuk digunakan (terpakai)
Harga & Lokasi
- Lokasi:
- , Poland

Hubungi
Butiran teknikal
Laser
Kuasa laser:
115,000 W
Maklumat lanjut
Bilangan gandar:
3
Butiran tawaran
- ID iklan:
- A22840980
- Nombor rujukan:
- PL-CUT-SEI-2008-00001
- Kemas kini:
- terakhir pada 29.09.2026
Penerangan
CO2 laser cutting machine manufactured in 2008. This SEI Laser Paper Blaster 02 features a sealed CO₂ laser with a nominal power of 115 W, designed for paper and cardboard processing. It includes an automatic sheet feeder with a maximum stack height of 350 mm and an integrated conveyor system for efficient operation. If you are looking to get high-quality cutting, marking, and engraving capabilities, consider the SEI Laser Paper Blaster 02 machine we have for sale. Contact us for further details.
Laser system
• Wavelength: ~10.6 µm
• Scanning head: 3-axis galvanometric system
• Axes: X/Y via scanning mirrors; Z with dynamic focusing (per optical setup)
• Working field: Approx. 200 × 200 to 500 × 500 mm
• Processing modes: Cutting, marking, engraving, micro-perforation
• Adjustable parameters: Laser power, frequency, processing speedPaper handling
• Feeding: Automatic sheet feeder with stack loader
• Max stack height: 350 mm
• Paper weight range: 120–300 g/m²
• Operation: Fully automatic cycle
• Transport: Integrated conveyor system
• Output: Automatic sheet discharge and collectionControl and software
• Control: PC-basedSafety and extraction
• Enclosed laser processing area
• Interlocked access doors
• Laser safety shutters
• Emergency-stop devices
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• Fume extraction connections (external unit required)Electrical data
• Supply voltage: 230 V AC, single phase with neutral and PE
• Frequency: 50/60 Hz
• Machine nameplate power: 200 W
• Machine nameplate current: 1 A
Laser system
• Wavelength: ~10.6 µm
• Scanning head: 3-axis galvanometric system
• Axes: X/Y via scanning mirrors; Z with dynamic focusing (per optical setup)
• Working field: Approx. 200 × 200 to 500 × 500 mm
• Processing modes: Cutting, marking, engraving, micro-perforation
• Adjustable parameters: Laser power, frequency, processing speedPaper handling
• Feeding: Automatic sheet feeder with stack loader
• Max stack height: 350 mm
• Paper weight range: 120–300 g/m²
• Operation: Fully automatic cycle
• Transport: Integrated conveyor system
• Output: Automatic sheet discharge and collectionControl and software
• Control: PC-basedSafety and extraction
• Enclosed laser processing area
• Interlocked access doors
• Laser safety shutters
• Emergency-stop devices
Pjdpfx Ajz Hbyyji Hjgt
• Fume extraction connections (external unit required)Electrical data
• Supply voltage: 230 V AC, single phase with neutral and PE
• Frequency: 50/60 Hz
• Machine nameplate power: 200 W
• Machine nameplate current: 1 A
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