Dr. TRESKY AG T-3000-FC3 – Stesen Die Bonder / Flip-Chip berketepatan tinggiDr. TRESKY AG T-3000-FC3 –
Precyzyjna stacja Die Bonder / Flip-Chip
Dr. TRESKY AG T-3000-FC3 – Stesen Die Bonder / Flip-Chip berketepatan tinggi
Dr. TRESKY AG T-3000-FC3 –
Precyzyjna stacja Die Bonder / Flip-Chip
Harga tetap ditambah cukai perkhidmatan
€19,999
Keadaan
Terpakai
Lokasi
Wymysłów 

Data asas
- Pengeluar:
- Dr. TRESKY AG T-3000-FC3 –
- Keadaan:
- sangat baik (terpakai)
Harga & Lokasi
Harga tetap ditambah cukai perkhidmatan
€19,999
- Lokasi:
- Wymysłów 10, 62-740 Tuliszków, Polska

Hubungi
Butiran tawaran
- ID iklan:
- A22981692
- Nombor rujukan:
- mb-ce083084-22281602
- Kemas kini:
- terakhir pada 15.10.2026
Penerangan
For sale is a professional Dr. TRESKY AG T-3000-FC3 station, manufactured by a renowned Swiss company. This is a high-quality laboratory device designed for the precise assembly and positioning of semiconductor structures (Die Bonding / Flip-Chip Assembly). It is used in research laboratories, as well as in the production of electronics, photonics, optoelectronics, and microelectronics. The T-3000-FC3 model is one of the most versatile platforms from Tresky and enables the execution of both basic and advanced assembly processes.
Technical specifications:
Manufacturer: Dr. TRESKY AG
Model: T-3000-FC3
Country of manufacture: Switzerland
Type: manual Die Bonder / Component Placer
FC3 Bond Force Control controller
Olympus SZ51 stereoscopic microscope
Precision XY table
Bond force control
Vacuum and pneumatic system
LED work lighting
Documentation included
Numerous working tips, holders, and accessories as shown in the photos
Applications
The device is used for:
assembly of semiconductor devices (Die Bonding),
Flip-Chip technology,
assembly of MEMS components,
production of photonics and optoelectronics,
assembly of VCSEL lasers,
assembly of sensors and hybrid circuits,
research and development work and prototyping.
Condition
The device is sold with extensive equipment as shown in the photos:
Olympus microscope,
FC3 controller,
documentation,
drawers with accessories,
set of tools and working tips,
Gjdjz Snb Repfx Altouh
pneumatic components and accessories.
The visual condition is very good. It is sold exactly in the configuration shown in the photos.
Iklan ini diterjemahkan secara automatik. Mungkin terdapat kesilapan terjemahan.
Technical specifications:
Manufacturer: Dr. TRESKY AG
Model: T-3000-FC3
Country of manufacture: Switzerland
Type: manual Die Bonder / Component Placer
FC3 Bond Force Control controller
Olympus SZ51 stereoscopic microscope
Precision XY table
Bond force control
Vacuum and pneumatic system
LED work lighting
Documentation included
Numerous working tips, holders, and accessories as shown in the photos
Applications
The device is used for:
assembly of semiconductor devices (Die Bonding),
Flip-Chip technology,
assembly of MEMS components,
production of photonics and optoelectronics,
assembly of VCSEL lasers,
assembly of sensors and hybrid circuits,
research and development work and prototyping.
Condition
The device is sold with extensive equipment as shown in the photos:
Olympus microscope,
FC3 controller,
documentation,
drawers with accessories,
set of tools and working tips,
Gjdjz Snb Repfx Altouh
pneumatic components and accessories.
The visual condition is very good. It is sold exactly in the configuration shown in the photos.
Iklan ini diterjemahkan secara automatik. Mungkin terdapat kesilapan terjemahan.
Iklan anda telah berjaya dipadamkan
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